14

Hardness of submicrometre abrasive particles and polish rate measurements

Year:
1999
Language:
english
File:
PDF, 287 KB
english, 1999
15

Mechanism of Cu removal during CMP in H2O2-glycine based slurries

Year:
1999
Language:
english
File:
PDF, 392 KB
english, 1999
16

Role of Film Hardness on the Polish Rates of Metal Thin Films

Year:
1999
Language:
english
File:
PDF, 317 KB
english, 1999
19

Chemical Mechanical Polishing of Ta

Year:
1999
Language:
english
File:
PDF, 61 KB
english, 1999